Teledyne FLIR will launch the FLIR Si2x-Pro Hazardous Location Acoustic Imaging Camera for Gas Leak, Mechanical Fault, and Partial Discharge Detection.
ams OSRAM has introduced its new IR:6 infrared (IR) LED chip technology, which increases brightness by up to 35 % and efficiency by up to
42 % compared to the existing chip technology used in ams OSRAM IR LED emitters.
The RX261/RX260 Group MCUs are ideal for applications such as home appliances, building and factory automation, and many others including smart locks, e-bikes and mobile thermal printers.
Global technology, software and engineering leader Emerson will exhibit its latest Floor to CloudTM packaging solutions at PACK EXPO Chicago, November 3-6, 2024.
At the FILTECH trade fair, which is taking place in Cologne from 12 to 14 November, MANN+HUMMEL will be presenting new filter models for cleaner mobility and cleaner air.
This partnership introduces XCarb® steel made with high levels of recycled steel, 100% renewable energy for its trusted Kabeldon power distribution system & helps reduce carbon footprint of key electrification equipment by 29%.
The trade fair presentation will focus on energy efficiency, IE5+ motor technology and decentralised drive electronics with new functional safety features.
Southco has launched the E3 Compact MIM compression latch, bringing new ergonomic and safety features to the durable family of compression latches in a low-profile package.
ACCIONA has secured new sustainable financing worth €300 million to fund key projects aimed at reducing carbon emissions and fostering sustainable growth in the Gulf Cooperation Council area (GCC).