25 {{ "2024-10-25T00:00:00+00:00" | date "MMM" }} '24

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Schneider Electric News

Schneider Electric launches stylish Miluz ZeTa home range of switches and sockets equipped Industry 1st AQI (Air Quality Indicator)

Schneider Electric unveils award-winning Miluz ZeTa range with space-saving switches, AQI, and smart home integration.

Read more…

24 {{ "2024-10-24T00:00:00+00:00" | date "MMM" }} '24

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Crestron News

Crestron Celebrates AV-over-IP Week with New Addition to the DM NVX Platform

The DM NVX brings USB-C connectivity across both the home as well as commercial settings and delivers multi-input switching across four inputs & supports 5K resolution.

Read more…

24 {{ "2024-10-24T00:00:00+00:00" | date "MMM" }} '24

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NXP News

GlobalFoundries, NXP to Deliver Next-Gen 22FDX Solutions for Automotive, IoT and Smart Mobile

This collaboration leverages GF’s 22FDX^® process technology platform and global manufacturing footprint to optimize the power, performance and time-to-market of NXP’s solutions.

Read more…

24 {{ "2024-10-24T00:00:00+00:00" | date "MMM" }} '24

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Siemens News

Siemens, ServiceNow strengthen shopfloor security & drive generative AI-powered automation

The new offering combines Siemens’ Sinec Security Guard and the Siemens Industrial Copilot with ServiceNow’s workflow automation.

Read more…

23 {{ "2024-10-23T00:00:00+00:00" | date "MMM" }} '24

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Teledyne FLIR

Teledyne FLIR at ADIPEC 2024

Teledyne FLIR will launch the FLIR Si2x-Pro Hazardous Location Acoustic Imaging Camera for Gas Leak, Mechanical Fault, and Partial Discharge Detection.

Read more…

23 {{ "2024-10-23T00:00:00+00:00" | date "MMM" }} '24

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ams OSRAM News

ams OSRAM Introduces New IR:6 Technology for Enhanced Performance in Security and Biometrics Applications

ams OSRAM has introduced its new IR:6 infrared (IR) LED chip technology, which increases brightness by up to 35 % and efficiency by up to 42 % compared to the existing chip technology used in ams OSRAM IR LED emitters.

Read more…

23 {{ "2024-10-23T00:00:00+00:00" | date "MMM" }} '24

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Renesas News

RENESAS INTRODUCES NEW RX261/RX260 GROUP MCUS

The RX261/RX260 Group MCUs are ideal for applications such as home appliances, building and factory automation, and many others including smart locks, e-bikes and mobile thermal printers.

Read more…

22 {{ "2024-10-22T00:00:00+00:00" | date "MMM" }} '24

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Emerson

Emerson to showcase packaging solutions that advance future of automation at PACK EXPO 2024 (Booth N-5345)

Global technology, software and engineering leader Emerson will exhibit its latest Floor to CloudTM packaging solutions at PACK EXPO Chicago, November 3-6, 2024.

Read more…

22 {{ "2024-10-22T00:00:00+00:00" | date "MMM" }} '24

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MANN + HUMMEL News

MANN+HUMMEL focuses on sustainability while maintaining high performance

At the FILTECH trade fair, which is taking place in Cologne from 12 to 14 November, MANN+HUMMEL will be presenting new filter models for cleaner mobility and cleaner air.

Read more…

22 {{ "2024-10-22T00:00:00+00:00" | date "MMM" }} '24

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ABB News

ABB, ArcelorMittal partner to lower environmental impact of power distribution systems

This partnership introduces XCarb^® steel made with high levels of recycled steel, 100% renewable energy for its trusted Kabeldon power distribution system & helps reduce carbon footprint of key electrification equipment by 29%.

Read more…

Case studies

Energy Optimization Of HVAC Systems Through Digital Retrofit

Schneider Electric launches stylish Miluz ZeTa home range of switches and sockets equipped Industry 1st AQI (Air Quality Indicator)

Schneider Electric unveils award-winning Miluz ZeTa range with space-saving switches, AQI, and smart home integration.

Crestron Celebrates AV-over-IP Week with New Addition to the DM NVX Platform

The DM NVX brings USB-C connectivity across both the home as well as commercial settings and delivers multi-input switching across four inputs & supports 5K resolution.

GlobalFoundries, NXP to Deliver Next-Gen 22FDX Solutions for Automotive, IoT and Smart Mobile

This collaboration leverages GF’s 22FDX^® process technology platform and global manufacturing footprint to optimize the power, performance and time-to-market of NXP’s solutions.

Siemens, ServiceNow strengthen shopfloor security & drive generative AI-powered automation

The new offering combines Siemens’ Sinec Security Guard and the Siemens Industrial Copilot with ServiceNow’s workflow automation.

Teledyne FLIR at ADIPEC 2024

Teledyne FLIR will launch the FLIR Si2x-Pro Hazardous Location Acoustic Imaging Camera for Gas Leak, Mechanical Fault, and Partial Discharge Detection.

ams OSRAM Introduces New IR:6 Technology for Enhanced Performance in Security and Biometrics Applications

ams OSRAM has introduced its new IR:6 infrared (IR) LED chip technology, which increases brightness by up to 35 % and efficiency by up to 42 % compared to the existing chip technology used in ams OSRAM IR LED emitters.

RENESAS INTRODUCES NEW RX261/RX260 GROUP MCUS

The RX261/RX260 Group MCUs are ideal for applications such as home appliances, building and factory automation, and many others including smart locks, e-bikes and mobile thermal printers.

Emerson to showcase packaging solutions that advance future of automation at PACK EXPO 2024 (Booth N-5345)

Global technology, software and engineering leader Emerson will exhibit its latest Floor to CloudTM packaging solutions at PACK EXPO Chicago, November 3-6, 2024.

MANN+HUMMEL focuses on sustainability while maintaining high performance

At the FILTECH trade fair, which is taking place in Cologne from 12 to 14 November, MANN+HUMMEL will be presenting new filter models for cleaner mobility and cleaner air.

ABB, ArcelorMittal partner to lower environmental impact of power distribution systems

This partnership introduces XCarb^® steel made with high levels of recycled steel, 100% renewable energy for its trusted Kabeldon power distribution system & helps reduce carbon footprint of key electrification equipment by 29%.

International

Case studies

Schneider Electric unveils award-winning Miluz ZeTa range with space-saving switches, AQI, and smart home integration.

The DM NVX brings USB-C connectivity across both the home as well as commercial settings and delivers multi-input switching across four inputs & supports 5K resolution.

This collaboration leverages GF’s 22FDX® process technology platform and global manufacturing footprint to optimize the power, performance and time-to-market of NXP’s solutions.

The new offering combines Siemens’ Sinec Security Guard and the Siemens Industrial Copilot with ServiceNow’s workflow automation.

Teledyne FLIR will launch the FLIR Si2x-Pro Hazardous Location Acoustic Imaging Camera for Gas Leak, Mechanical Fault, and Partial Discharge Detection.

ams OSRAM has introduced its new IR:6 infrared (IR) LED chip technology, which increases brightness by up to 35 % and efficiency by up to 42 % compared to the existing chip technology used in ams OSRAM IR LED emitters.

The RX261/RX260 Group MCUs are ideal for applications such as home appliances, building and factory automation, and many others including smart locks, e-bikes and mobile thermal printers.

Global technology, software and engineering leader Emerson will exhibit its latest Floor to CloudTM packaging solutions at PACK EXPO Chicago, November 3-6, 2024.

At the FILTECH trade fair, which is taking place in Cologne from 12 to 14 November, MANN+HUMMEL will be presenting new filter models for cleaner mobility and cleaner air.

This partnership introduces XCarb® steel made with high levels of recycled steel, 100% renewable energy for its trusted Kabeldon power distribution system & helps reduce carbon footprint of key electrification equipment by 29%.

International

This collaboration leverages GF’s 22FDX^® process technology platform and global manufacturing footprint to optimize the power, performance and time-to-market of NXP’s solutions.

This partnership introduces XCarb^® steel made with high levels of recycled steel, 100% renewable energy for its trusted Kabeldon power distribution system & helps reduce carbon footprint of key electrification equipment by 29%.