28 {{ "2024-10-28T00:00:00+00:00" | date "MMM" }} '24

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GE Vernova News

GE Vernova’s GridOS Software Supports Energy Exchange for West African Power Pool

GridOS, deployed at the new Information and Coordination Centre in Benin, will oversee energy exchange across 14 ECOWAS nations, advancing a unified and sustainable power market for West Africa.

Read more…

26 {{ "2024-10-26T00:00:00+00:00" | date "MMM" }} '24

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Metz Connect News

METZ CONNECT IP44 is made For surface-mounted and flush-mounted installation in harsh environments

The demand for cabling solutions for Ethernet applications in covered outdoor areas and in areas subject to mechanical stress is constantly increasing.

Read more…

25 {{ "2024-10-25T00:00:00+00:00" | date "MMM" }} '24

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Johnson Controls News

Johnson Controls announces York MCV CRAH for more sustainable data centers

The YORK Mission Critical Vertical Computer Room Air Handler is engineered to deliver reliable cooling in above-floor or under-floor data center applications, with a compact footprint, multiple cooling capacities & true plug & play functionality.

Read more…

25 {{ "2024-10-25T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-25T00:00:00+00:00" | date "longDate" }}

Schneider Electric News

Schneider Electric launches stylish Miluz ZeTa home range of switches and sockets equipped Industry 1st AQI (Air Quality Indicator)

Schneider Electric unveils award-winning Miluz ZeTa range with space-saving switches, AQI, and smart home integration.

Read more…

24 {{ "2024-10-24T00:00:00+00:00" | date "MMM" }} '24

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Crestron News

Crestron Celebrates AV-over-IP Week with New Addition to the DM NVX Platform

The DM NVX brings USB-C connectivity across both the home as well as commercial settings and delivers multi-input switching across four inputs & supports 5K resolution.

Read more…

24 {{ "2024-10-24T00:00:00+00:00" | date "MMM" }} '24

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NXP News

GlobalFoundries, NXP to Deliver Next-Gen 22FDX Solutions for Automotive, IoT and Smart Mobile

This collaboration leverages GF’s 22FDX^® process technology platform and global manufacturing footprint to optimize the power, performance and time-to-market of NXP’s solutions.

Read more…

24 {{ "2024-10-24T00:00:00+00:00" | date "MMM" }} '24

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Siemens News

Siemens, ServiceNow strengthen shopfloor security & drive generative AI-powered automation

The new offering combines Siemens’ Sinec Security Guard and the Siemens Industrial Copilot with ServiceNow’s workflow automation.

Read more…

23 {{ "2024-10-23T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-23T00:00:00+00:00" | date "longDate" }}

Teledyne FLIR

Teledyne FLIR at ADIPEC 2024

Teledyne FLIR will launch the FLIR Si2x-Pro Hazardous Location Acoustic Imaging Camera for Gas Leak, Mechanical Fault, and Partial Discharge Detection.

Read more…

23 {{ "2024-10-23T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-23T00:00:00+00:00" | date "longDate" }}

ams OSRAM News

ams OSRAM Introduces New IR:6 Technology for Enhanced Performance in Security and Biometrics Applications

ams OSRAM has introduced its new IR:6 infrared (IR) LED chip technology, which increases brightness by up to 35 % and efficiency by up to 42 % compared to the existing chip technology used in ams OSRAM IR LED emitters.

Read more…

23 {{ "2024-10-23T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-23T00:00:00+00:00" | date "longDate" }}

Renesas News

RENESAS INTRODUCES NEW RX261/RX260 GROUP MCUS

The RX261/RX260 Group MCUs are ideal for applications such as home appliances, building and factory automation, and many others including smart locks, e-bikes and mobile thermal printers.

Read more…

Market Overview

The Transition to Heat Pump Chillers for Simultaneous Heating and Cooling

Case studies

Digital Actuators Optimize HVAC for Gas-Free Building

GE Vernova’s GridOS Software Supports Energy Exchange for West African Power Pool

GridOS, deployed at the new Information and Coordination Centre in Benin, will oversee energy exchange across 14 ECOWAS nations, advancing a unified and sustainable power market for West Africa.

METZ CONNECT IP44 is made For surface-mounted and flush-mounted installation in harsh environments

The demand for cabling solutions for Ethernet applications in covered outdoor areas and in areas subject to mechanical stress is constantly increasing.

Johnson Controls announces York MCV CRAH for more sustainable data centers

The YORK Mission Critical Vertical Computer Room Air Handler is engineered to deliver reliable cooling in above-floor or under-floor data center applications, with a compact footprint, multiple cooling capacities & true plug & play functionality.

Schneider Electric launches stylish Miluz ZeTa home range of switches and sockets equipped Industry 1st AQI (Air Quality Indicator)

Schneider Electric unveils award-winning Miluz ZeTa range with space-saving switches, AQI, and smart home integration.

Crestron Celebrates AV-over-IP Week with New Addition to the DM NVX Platform

The DM NVX brings USB-C connectivity across both the home as well as commercial settings and delivers multi-input switching across four inputs & supports 5K resolution.

GlobalFoundries, NXP to Deliver Next-Gen 22FDX Solutions for Automotive, IoT and Smart Mobile

This collaboration leverages GF’s 22FDX^® process technology platform and global manufacturing footprint to optimize the power, performance and time-to-market of NXP’s solutions.

Siemens, ServiceNow strengthen shopfloor security & drive generative AI-powered automation

The new offering combines Siemens’ Sinec Security Guard and the Siemens Industrial Copilot with ServiceNow’s workflow automation.

Teledyne FLIR at ADIPEC 2024

Teledyne FLIR will launch the FLIR Si2x-Pro Hazardous Location Acoustic Imaging Camera for Gas Leak, Mechanical Fault, and Partial Discharge Detection.

ams OSRAM Introduces New IR:6 Technology for Enhanced Performance in Security and Biometrics Applications

ams OSRAM has introduced its new IR:6 infrared (IR) LED chip technology, which increases brightness by up to 35 % and efficiency by up to 42 % compared to the existing chip technology used in ams OSRAM IR LED emitters.

RENESAS INTRODUCES NEW RX261/RX260 GROUP MCUS

The RX261/RX260 Group MCUs are ideal for applications such as home appliances, building and factory automation, and many others including smart locks, e-bikes and mobile thermal printers.

International

Market Overview

Case studies

GridOS, deployed at the new Information and Coordination Centre in Benin, will oversee energy exchange across 14 ECOWAS nations, advancing a unified and sustainable power market for West Africa.

The demand for cabling solutions for Ethernet applications in covered outdoor areas and in areas subject to mechanical stress is constantly increasing.

The YORK Mission Critical Vertical Computer Room Air Handler is engineered to deliver reliable cooling in above-floor or under-floor data center applications, with a compact footprint, multiple cooling capacities & true plug & play functionality.

Schneider Electric unveils award-winning Miluz ZeTa range with space-saving switches, AQI, and smart home integration.

The DM NVX brings USB-C connectivity across both the home as well as commercial settings and delivers multi-input switching across four inputs & supports 5K resolution.

This collaboration leverages GF’s 22FDX® process technology platform and global manufacturing footprint to optimize the power, performance and time-to-market of NXP’s solutions.

The new offering combines Siemens’ Sinec Security Guard and the Siemens Industrial Copilot with ServiceNow’s workflow automation.

Teledyne FLIR will launch the FLIR Si2x-Pro Hazardous Location Acoustic Imaging Camera for Gas Leak, Mechanical Fault, and Partial Discharge Detection.

ams OSRAM has introduced its new IR:6 infrared (IR) LED chip technology, which increases brightness by up to 35 % and efficiency by up to 42 % compared to the existing chip technology used in ams OSRAM IR LED emitters.

The RX261/RX260 Group MCUs are ideal for applications such as home appliances, building and factory automation, and many others including smart locks, e-bikes and mobile thermal printers.

International

This collaboration leverages GF’s 22FDX^® process technology platform and global manufacturing footprint to optimize the power, performance and time-to-market of NXP’s solutions.