At Mostra Convegno Expocomfort (MCE) trade show, Siemens Smart Infrastructure will present a completely renewed portfolio designed to accelerate the decarbonization of commercial, industrial, and residential buildings.
Invited paper reports 3-step characterization chain and resulting methodologies and metrics that accelerate learning, provide data on device performance expectations at cryogenic temperatures.
You often see public charging stations in the German-speaking world reading the letters ME. They stand for "Mess- und Eichrecht" (measurement and calibration act). But what does that mean? What other calibration standards are out there? And why do I need a calibrated wallbox for my personal use? Here are the answers.
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced it plans to showcase smart sensing applications that make life easier, safer and greener at Sensors Converge 2022.
Blaize® today announced plans to demonstrate its Blaize Graph Streaming Processor (GSP®) architecture with partner companies exhibiting next week at Embedded World 2022 June 21-23.
NXP Semiconductors today announced the new MCX portfolio of microcontrollers, designed to advance innovation in smart homes, smart factories, smart cities and across many emerging industrial and IoT edge applications.
TDK Corporation announces the successful integrations of the InvenSense CH201 ultrasonic Time-of-Flight sensors into the Kaadas K9-F 3D Face Push-Pull WiFi smart door lock, enabling its face recognition functionality to automatically unlock for recognized users, which was recently launched into the consumer market.