07
'23
Written on
Aggreko
07
'23
Written on
Hanwha News
Hanwha Embracing a Sustainable Future with Technology
Designed around energy-saving principles, Hanwha Vision’s product and technology deliver a sustainable approach for security and monitoring needs.
07
'23
Written on
Ksenia Security News
Why it is important to consider a wireless Ksenia alarm system for your home
Wireless technology can be used to create an efficient and reliable alarm system in addition to traditional wired security systems.
06
'23
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Siemens News
Siemens data platform helps Northumbrian Water to tackle household leaks
Northumbrian Water Group to connect more than one million smart water meters to Siemens data management system. Cloud-based system will identify household leaks to help reduce water consumption and support Ofwat targets.
06
'23
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Terabee News
Sensirion and Terabee partner up for enhanced indoor air quality monitoring to reduce air pollution and improve health
The Terabee Air Quality SB5 accurately measures the environment indoors. It relies on Sensirion environmental sensors, for guaranteed stability and automatic recalibration during the life of the device, measuring up to five ambient metrics using Swiss-made sensors, to help reduce air pollution and improve health.
06
'23
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LENNOX EMEA
Wolseley and Friga-Bohn (part of the Lennox EMEA group) Partnership Join Forces to deliver High-Quality Industrial Refrigeration Solutions
An exciting new partnership between Wolseley and Friga-Bohn will provide contractors and end-users with access to the latest advances in high-efficiency refrigeration products for heavy-commercial and industrial applications.
05
'23
Written on
Theben News
THEBEN LAUNCHES KNX DALI FLUSH-MOUNTED DIMMING ACTUATORS IN TP AND RF VERSIONS
The new KNX DALI flush-mounted dimming actuators from Theben offer a simple and cost-effective alternative to KNX/DALI gateways where these would be oversized due to a small number of luminaires and lighting groups.
05
'23
Written on
Emerson Automation Solutions
Emerson to showcase Floor to Cloud packaging solutions at PACK EXPO 2023 (Booth SL-6107)
Global technology, software and engineering leader Emerson will exhibit its Floor to Cloud packaging solutions at PACK EXPO Las Vegas, September 11-13, 2023. As the future of automation, Floor to Cloud solutions empower smarter packaging lines and more efficient processes that make it possible for manufacturers to continuously improve plant productivity, sustainability and safety.
05
'23
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HARTING USA
3D-Circuits - Enabling 3D-Placement Of Electronic Components
Engineers are using miniaturized components and flexible or rigid-flex PCBs. However, a very strong trend is 3D packaging. Are you curious whether the chip carrier from HARTING also offers many advantages for your product?.
04
'23
Written on
NORD Drivesystems
