Molex unveils VersaBeam EBO connectors, offering high-density, dust-resistant fiber connectivity for hyperscale data centers, cutting cleaning needs and speeding up deployment, showcased at OFC 2025 in San Francisco from April 1-3.

Molex has introduced a thermal management solution that reduces the time and cost of deploying and upgrading high-performance data centers to meet unrelenting demand for generative AI and machine learning workflows.

Molex has published a report that examines thermal management pitfalls and possibilities as data center architects and operators strive to balance high-speed data throughput requirements with the impacts of growing power density and the need for heat dissipation on critical servers and interconnect systems.

Molex, a leading global connectivity and electronics solutions provider, released results of a global survey of decision makers from telecom carriers exploring the “state of 5G” and the significant transformational opportunities it presents, along with its impact on deployment progress, current delivery challenges and emerging business prospects.